European Projects, FP7
Date: 30/09/2012 - 29/09/2015
Coordinator:
University College Cork-national Univresity of Ireland
Consortium:
Volume:
5,1 Mio. €
Project:
The PowerSwipe project addresses a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology with novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, in a 3D heterogeneous stack, using eWLB technology, with the μController chip.
Postal address ECPE e.V.:
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D-90482 Nuremberg, Germany
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