Workshop
Date: 09/10/2024 - 10/10/2024
Location: Hanau, Germany
Technical Chair:
Karl-Friedrich Becker, Fraunhofer IZM (DE)
Shiori Idaka Mitsubishi, Mitsubishi Electric Europe (DE)
Contact:
Ingrid Bollens, ECPE e.V.
+49 911 81 02 88 – 10
ingrid.bollens@ecpe.org
Registration Deadline: 02 October 2024
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Power electronics packaging is a dynamic and multidisciplinary field. On the one side it enables full performance of power semiconductors, and on the other side it determines the performance of a power converter. Power semiconductors with a wide bandgap become commercialized more and more. They offer not only a higher breakdown voltage, but also higher operating temperature and faster switching. Packaging concepts and materials need to be adapted to these needs. Processability for new packaging concepts, low dielectric losses or high breakdown voltage are only some characteristics, materials for power packaging must provide. In this ECPE workshop, we will have a look at new developments and trends in materials needed for building power electronic discretes, modules and converters. We will cover trends in interconnection technologies for chips and large areas, we will discuss developments in potting and encapsulation, and take a look at new substrates as basis for many modules. Embedding power electronic semiconductors or passives into PCBs finds its way into commercial products step by step, so we will as well look at ongoing activities in this field, especially the development of FR4 and other PCB materials especially suited for power electronics with its need for high temperaturestability and low CTE. Material characterization and inspection methods will be introduced. An overview over existing and upcoming EU regulations on materials will complete the programme.
All presentations and discussions will be in English language.
Workshop
Date: 09/10/2024 - 10/10/2024
Location: Hanau, Germany
Technical Chair:
Karl-Friedrich Becker, Fraunhofer IZM (DE)
Shiori Idaka Mitsubishi, Mitsubishi Electric Europe (DE)
Contact:
Ingrid Bollens, ECPE e.V.
+49 911 81 02 88 – 10
ingrid.bollens@ecpe.org
Registration Deadline: 02 October 2024
Postal address ECPE e.V.:
ECPE European Center for Power Electronics e.V.
Ostendstrasse 181
D-90482 Nuremberg, Germany
Phone: +49 (0)911 81 02 88-0
© 2018 ECPE European Center for Power Electronics e.V.