EMPC 2025 - European Microelectronics & Packaging Conference

Deadline for abstract submission is extended to February 10, 2025!

The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.

The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

IMAPS-France looks forward to welcoming you to the beautiful city of Grenoble in September 2025!

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